E-LIT – Automated testing solution system allows non-contact failure inspection of semiconductor material during the manufacturing process. Inhomogeneous temperature distribution, local power loss can be measured with Lock-in Thermography. This is achieved by using the shortest measurement times combined with a high-performance thermographic camera and a specialised lock-in procedure.
The power supply for this process is clocked with a synchronisation module and failures that produce mK or even μK differences are reliably detected.
Smallest defects like point and line shunts, oxide failures, transistor and diode failures on a PCB surface and in IC´s can be detected and displayed in x and y positions. Additionally, it is possible to analyse stacked-die packages or multi-chip modules in z-direction with merely changing the lock-in frequency.
Benefits of the Modular Test Bench
- Online lock-in measurement with the highest sensitivity
- Complete and detailed microscopy analysis
- Geometrical resolution up to 1.3 μm per pixel with microscope lenses
- Thermal resolution in the microkelvin range
- Multi-layer analysis
- Automatic scanning of larger samples due to precision mechanics
Thermographic Images with Different Optics
Thermographic Software IRBIS® 3 active
- Operational software with comprehensive analysis options in laboratory conditions
- Software add-on for automatic error classification based on parameter settings
- Intuitive user interface for easy operation
- Real-time display of the object being measured in various states
- Multifaceted memory options for image data and measurement results
- Alternative 0°, 90° or customised set phase angle image for representation of complex intensity information
- Merging live and amplitude image
- Optional: IV measurement, under sampling, drift compensation, DC-mode, power loss measurement, user and protocol administration, interface preparation: e.g. Profibus, Ethernet
