Improvement of product and process characteristics through energy optimization
The thermal imaging camera enables a detailed analysis of heat generation in components and processes
Hotspots provide insights into defects and areas requiring optimization
The thermal imaging camera’s high pixel count reduces the risk of measurement errors
Every manufacturing process requires energy. Energy is also consumed or released during the use of products. Since a large portion of this energy is generated or utilized as heat, a precise analysis of these processes is crucial. The results help optimize manufacturing processes and support the targeted development of new products.
Thermal imaging cameras are well-suited even for highly demanding tasks, as they measure without contact, meaning without physical contact with the object being measured. Thanks to the visual representation of temperature distribution, even complex thermal processes can be easily captured. The thermographic software family IRBIS® 3 specifically complements these strengths. A wide range of analysis options precisely displays both spatial and temporal changes in temperature within the image field.
If thermal imaging reveals hotspots – i.e., areas with particularly high temperatures – in products such as printed circuit boards, this may indicate a defect. However, if this temperature rise appears normal, heat dissipation can be optimized to reduce subsequent overheating of the component itself or surrounding areas. Sufficient geometric resolution of the measurement object is crucial for detecting hotspots using a thermal imaging camera. A reliable conclusion can only be drawn if the details are properly resolved by a sufficiently large number of pixels. Therefore, a high-resolution thermal imaging camera from InfraTec is the top choice in product development.
Special features and the potential of high-speed thermal imaging
Presentation of technical solutions and InfraTec camera models
Explanation of important parameters and their influence on thermal imaging
Presentation of various functions to adapt your camera to the application requirements
Challenges of electronics testing
Improvement of electronics design and thermal management by understanding heat
Thermography in the various phases of electronics development and production
Important and relevant selection criteria
Theoretical background – mechanical force, stress and temperature Methods for analysis
Examples from practice with application samples – elastic periodical load test and fatigue test
Short overview about InfraTec products
Complementary technical lecture
"Contribution of Thermoelastic Stress Analysis in mechanics of materials and structures: some illustrations" from Prof. Vincent Le Saux, École Nationale Supérieure de Techniques Avancées Bretagne
What are the physical characteristics of micro-thermography?
What are the technical requirements for an IR camera system?
Which selection criteria are important and relevant?
In which application areas is micro-thermography used?
In addition, further on-demand webinars about thermal optimisation of components and assemblies offer in-depth information on specific applications and solutions. Take a look at the following webinars.
It is not unusual for tasks to be associated with special requirements. Discuss your specific application needs with our specialists, receive further technical information or learn more about our additional services.








