Analysing electronic components the ISIT has to detect smallest possible temperature differences. It does so by using the thermal camera ImageIR® 8300 from InfraTec which can precisely measure temperature differences of 20 mK securely identifying any even just emerging thermal issue. Thus, development failures can be avoided at an early stage. By using a detec-tor with (640 x 512) IR pixels at a 15 µm pitch and a high performance 3x microscopic lens a geometric reso-lution of only 5 µm can be achieved. At the same time, a field of view of (3.2 x 2.6) mm2 is displayed which is suitable for many microelectronic applications. Additional, easily interchangeable lenses with a range of focal lengths enable the ISIT to further exploit the flexibility of their infrared camera across a wide variety of applications.

Inverter with loaded components to forecast their lifecycle

Another benefit for the ISIT derives from the precision calibration of the ImageIR® 8300 camera. The use of a set of additional side calibration curves compensates for drift and ensures a maximum measurement accuracy even under fluctuating measurement conditions. As with all thermographic testings of electronic components and circuits, measurements are influenced by the differing emissivity of the individual components. To overcome this situation, InfraTec offers an automated pixel wise emissivity correction routine directly in its control and analysis software IRBIS® 3. Using these tools precise statements can be made about temperature distributions and developments over time. With the time component of the heating playing an increasingly important role in the ever decreasing sizes of components, the ISIT is able to take advantage of the multi-kHz frame rates possible with the ImageIR® 8300.

Infrared camera ImageIR® 8300 Series from InfraTec

InfraTec Solution

Fraunhofer Institute for Silicon Technology (ISIT)
25524 Itzehoe

Infrared camera: ImageIR® 8300

Advantages of this Thermography Solutions in this Application

  • Learn more about the modular concept

    Modular Concept for Your Flexibility

    The camera can be adapted to all requirements of the user due to modular design of the camera series ImageIR®. This means that a customer-specific thermography system is achieved in every direction. But the ImageIR® can also be subsequently retrofitted or upgraded in the event of changing measurement requirements. In this way, maximum investment security is achieved.

  • InfraTec thermography - Geometrical Resolution

    Geometrical Resolution – Efficient Analysis of Complex Assemblies

    InfraTec's infrared cameras with cooled and uncooled detectors have native resolutions up to (1,920 × 1,536) IR pixels. Spatially high-resolution thermograms ensure that components and assemblies are imaged down to the smallest detail and thus defects can be reliably detected and precisely localised.

  • HighSense for thermographic camera series ImageIR®
    Further Information about HighSense

    HighSense – Always the Optimal Camera Setting

    Thanks to HighSense, ImageIR® users have the option of setting up individual measuring ranges based on the factory calibration that best suit the respective task. The software also offers the possibility of storing a large number of such areas clearly arranged. Individually named and permanently stored, the operator can quickly access them. The same applies to changing, renaming and deleting profiles. HighSense is available for different camera models of the ImageIR® series. This function can optionally be added to systems already delivered.

Relevant Industries & Applications

  • microthermography


    Micro-thermography allows for the thermal analysis of extremely small structures in the micrometer range, providing a detailed representation of the temperature distribution on complex electronic assemblies and components.