Infrared Lock-in Thermography for Inspection of Electronics and Integrated Circuits
The thermographic inspection of electronic components and assemblies is an established test procedure for failure detection and quality management – from the development of first prototypes to serial production. Learn more about the use of lock-in thermography for failure analysis in electrical engineering and electronics in our online event.
Complementary Technical Lecture
We are pleased to announce a technical lecture from thermography practice:
"Challenges and Applications of Thermography in Microelectronics"
Speaker: Marko Hoffmann, Infineon Technologies Dresden GmbH & Co. KG